Samsung is now using a new circuit board design especially for the Galaxy S9 lineup, Korean outlet ETNews reported Friday, citing industry sources.
The same report provides a visual component breakdown of one of the company’s upcoming Android flagships which can be seen below and is said to depict a printed circuit board meant to be included in the Galaxy S9 series. By relying on a Substrate Like PCB, Samsung should be able to equip its upcoming devices with a larger battery without altering their overall physical footprint or making compromises in another manner.
Rumors of the technology being implemented into the Galaxy S9 and Galaxy S9 Plus originally emerged over the summer but have now been further expanded upon, with insiders claiming that only the international variants of the devices will use the solution.
The South Korean tech giant already confirmed the Galaxy S9 and Galaxy S9 Plus will be announced late next month at MWC 2018, with recent rumors suggesting both handsets will start retailing on March 16th following a two-week pre-order period.
The Galaxy S9 and S9 Plus will have a very different camera configuration. The Galaxy S9 will feature a 12MP rear-facing camera with OIS , while the Galaxy S9 Plus is said to come with a dual-camera setup (12MP+12MP) and with the screen size of 5.77-inch Galaxy S9 and 6.22-inch Galaxy S9 Plus.
The report claims the Galaxy S9/S9+ will feature cameras with the highest level of lens brightness: F1.5. The report also confirms the Galaxy S9 will feature a variable aperture of F1.5/F2.4 and it will work similar to a DSLR camera. Users will be able to adjust the aperture before taking a picture.
The technology isn’t new, as Samsung included it inside one of its last year high-end smartphones, the W2018, which is exclusively available in China.