Samsung Galaxy S10 series has come forth with lots of new features and beautiful design, but It's time to explore the real hardware that empowers these new technologies inside all three of the Galaxy S10 devices and requires a teardown process.
The teardown that we're looking today is coming from iFixit, and the guys behind this mission have disassembled every piece of this new device to found out what's in there and come up with the following report.
Before we dive into the highlights, let's look at the total repairability score that Galaxy S10 devices received is 3 out of 10 which makes it very difficult to repair.
The displays of these devices are placed with adhesive and from inside there's the new Ultrasonic fingerprint scanner that's strictly intact with the screen. While the touch controller IC of Galaxy S10e is same as S9. The displays are backed by layers of copper and graphite to dissipate the heat generated by other components.
Also, the replacement of displays pretty nifty but the replacement will be pricey and difficult.
The 128GB version uses Toshiba's UFS NAND flash while 512GB and 1TB drives are Samsung's own eUFS NAND Flash. Apart from storage chips, there are RAM and SoC placed along with audio codec and RF fusion modules.
The motherboard contains a massive heat pipe that's similar to Note 9's pipe and works to cool off the thermal stress on the internal parts of the devices.
Batteries are heavily glued and not easily replaceable, while wireless charing of other devices from these phones make a lot of heat and may not be good for long-term battery usage.
The teardown expert shared some final thoughts on this dismantling below.