Samsung’s next year’s Galaxy S-series devices are expected to be packed with lots of new feature and hardware changes and to make these things happen the company could apply the next-generation Substrate-like PCB (SLP) to its next-gen smartphone.
According to ETNews, Samsung could use the SLP circuit module in Galaxy S10 series for models equipped with Samsung Exynos chip.
SLP is a component that combines a semiconductor substrate manufacturing method with a High-Density Interconnect (HDI), which allows SLP to use even more layers of material. In addition, SLP can connect even thinner components, to take advantage of small onboard chips.
The main reason why manufacturers using this PCB type, is because it allows to shrink the main board and make room for a larger component such as a bigger battery or to embed several more high-end components for further performance improvements.
Samsung first introduced SLP in the Galaxy S9 devices, then to the Galaxy Note 9, and now the company seems to continue the SLP legacy as part of its smartphone manufacturing process 2019 flagships.
Disclaimer: The above report is based on the respective source.